0.35mm pitch, 0.8mm stack — Hirose BM23 mezzanine receptacle
The Hirose BM23PF0.8-14DS-0.35V(51) is a 14-position receptacle with center strip contacts from the BM23 series, designed for board-to-board mezzanine stacking at a 0.8mm mated height. Gold-plated contacts with 1.97µin thickness handle the mating cycles typical of internal consumer electronics and portable device assemblies, where the connector lives inside a shielded enclosure and sees limited reconnection.
14 positions — mid-range option in the BM23PF0.8 family
The 14-position variant sits between the 10-position BM23PF0.8-10DS-0.35V(895) and the 20-position BM23PF0.8-20DS-0.35V(51) in the same BM23PF0.8 base product line. For a BOM that needs 14 signal lines in a 0.8mm stack height, this is the exact footprint match; the 10-position sibling leaves four lanes empty, and the 20-position requires a wider PCB keep-out. No pitch or height delta to manage across the series, so a layout designed for one position count can scale to another with only a footprint change.
SMT termination with solder retention
Surface-mount termination with the solder retention feature means the connector stays put during reflow without secondary adhesive. The dual-row layout with center strip contacts routes signals through the middle of the connector body, which simplifies the fan-out on inner layers compared to perimeter-contact designs at this pitch.