Board-Level Fit: 0.35mm Pitch and 0.80mm Stack Height
The Hirose BM23PF0.8-20DS-0.35V(51) is a 20-position receptacle with center strip contacts from the BM23 series, designed for parallel board-to-board stacking at a mated height of 0.80mm. The 0.35mm pitch packs 20 circuits into a dual-row layout that fits high-density mezzanine applications — think compact handheld devices, camera modules, or internal display interconnects where every millimeter of board real estate counts.
The BM23 series offers the same 0.35mm pitch and 0.80mm stack height across multiple position counts. The 20-position BM23PF0.8-20DS-0.35V(51) sits between the 14-position BM23PF0.8-14DS-0.35V(51) and the 24-position BM23PF0.8-24DS-0.35V(51). The choice is driven by the signal count on the BOM — match the position count to the circuit count; the footprint and routing density scale directly with the number of contacts.