Board-Stacking Header for Tight Z-Axis Budgets
The Hirose BM23PF0.8-24DP-0.35V(895) is a 24-position header from the BM23 series, built for board-to-FPC interconnects where vertical clearance is tight. It uses outer shroud contacts and a 0.014" (0.35mm) pitch, with a mated stacking height of 0.8mm and a height above board of just 0.025" (0.63mm). Gold-plated contacts (1.97µin) handle repeated mating cycles in portable electronics.
Position Count vs. Sibling Variants
This 24-position header sits between the 20-position BM23PF0.8-20DP-0.35V(895) and the 30-position BM23PF0.8-30DP-0.35V(51) in the same BM23 series. Pick the one that matches your circuit count on the BOM.
