Tight-Pitch Mezzanine Header for Dense Board Stacks
The Hirose BM23PF0.8-30DP-0.35V(51) is a 30-position header from the BM23 series, designed for board-to-board mezzanine connections where vertical space is at a premium. Its 0.014" (0.35mm) pitch packs 30 circuits into a dual-row layout, and the mated stacking height of 0.8mm keeps the board gap minimal — typical for compact handheld devices, camera modules, or display interconnects where every tenth of a millimeter counts.
Position Count and Pitch — Matching the BOM Line
The 30-position count is the primary BOM matching criterion. The BM23 series also offers a 24-position version (BM23PF0.8-24DP-0.35V(51)) at the same 0.014" (0.35mm) pitch and 0.8mm stack height — so if your circuit count is lower, the 24-position variant saves board real estate without changing the footprint pitch or the mating interface. Both use the same contact finish and solder retention features, so the swap is a straight position-count decision.
It is RoHS compliant. No official cross-reference or direct second-source is on record; the BM23PF0.8-30DP-0.35V(895) is a packaging variant (Digi-Reel® option) with identical electrical and mechanical specs.