The Hirose BM23PF0.8-30DP-0.35V(895) is a 30-position header from the BM23 series, designed for board-to-FPC mezzanine stacking at a tight 0.8mm mated height.
Stack height and board clearance
The mated stacking height is 0.8mm, with the header sitting 0.63mm above the board surface. That 0.63mm profile means the connector clears tight z-height budgets in folded assemblies — think a display flex folded over a main PCB inside a phone or wearable. The 0.35mm pitch keeps the trace escape routing dense; expect micro-vias or blind vias in the breakout region to keep the signal layers manageable.
Solder retention and mounting
Surface mount termination with the solder retention feature means the part stays put through the reflow oven without secondary clinching.