The Hirose BM23PF0.8-30DS-0.35V(895) is a 30-position receptacle with center strip contacts from the BM23 series, designed for board-to-board mezzanine stacking. The 0.014" (0.35mm) pitch and 0.80mm mated stacking height target dense, low-profile interconnects in portable electronics, wearables, and compact modules where every millimeter of z-height matters. The dual-row arrangement packs 30 circuits into a narrow footprint, and the gold-plated contacts — with 1.97µin (0.050µm) thickness — handle moderate mating cycles in controlled indoor environments.
Why the 0.35mm Pitch Dictates Your Board Layout
A 0.35mm pitch is tight — it forces fine-line PCB routing and a soldering process capable of preventing bridging between adjacent pads. The 0.80mm mated stack height means the opposing board sits just 0.8mm above this receptacle, so any component on the underside of the mating board must clear that gap. The solder retention feature provides mechanical anchoring during reflow, resisting the shear forces that can shift a fine-pitch SMT connector before the solder solidifies.