0.35mm Pitch Mezzanine Header, 0.8mm Stack
The Hirose BM23PF0.8-40DP-0.35V(51) is a 40-position header from the BM23 series, designed for board-to-board stacking at a mated height of 0.8mm. The 0.35mm pitch and dual-row layout pack 40 outer shroud contacts into a compact footprint, typical for high-density signal interconnects in mobile devices, wearables, and compact camera modules where z-height is tight. Gold flash plating (1.97µin) on the contacts protects against corrosion in the unmated state, though the thin layer limits the connector to a modest number of mating cycles — typical for a one-time assembly or infrequent field service.
40 vs 46 Positions — Same Pitch, Same Stack
The BM23 series offers the same 0.35mm pitch and 0.8mm stacking height across position counts. The 40-position BM23PF0.8-40DP-0.35V(51) and the 46-position BM23PF0.8-46DP-0.35V(51) share identical footprint geometry per row — the extra 6 contacts extend the connector length along the board edge.