0.35mm Pitch Mezzanine Header for Tight Board Spacing
The Hirose BM23PF0.8-54DP-0.35V(895) is a 54-position header from the BM23 series, designed for board-to-FPC or board-to-board mezzanine connections where the z-height budget is tight. The 0.35mm pitch and 0.8mm mated stacking height place this connector squarely in ultra-compact handheld and portable device applications — think smartphone display interconnects, compact camera modules, or wearable electronics where every tenth of a millimeter of board spacing matters.
Position Count and Stack Height — the BOM Fit Check
The 54 positions at 0.35mm pitch match a 54-circuit FPC or receptacle footprint. The 0.8mm stacking height is the mated dimension — confirm your board-to-board or board-to-FPC gap accommodates this height plus the receptacle's own profile.
No official cross-reference or second-source is on record; the BM23PF0.8-54DP-0.35V(51) is the same part with a different packaging suffix (Digi-Reel® vs Cut Tape), not a functional alternative.