Board-to-Board Mezzanine Receptacle for Tight Stack Heights
The Hirose BM23PF0.8-54DS-0.35V(895) is a 54-position receptacle with center strip contacts from the BM23 series, designed for parallel board-to-board stacking at a mated height of 0.8mm.
With a mated stacking height of 0.8mm and a height above board of 0.031" (0.80mm), this receptacle defines the z-axis clearance between the two PCBs. The 0.35mm pitch sets the lateral pad spacing — any mismatch with the mating header's pitch breaks the connection entirely. The 54-position count is the BOM line match; the BM23PF0.8-46DS-0.35V(895) carries 46 positions at the same 0.35mm pitch and 0.8mm stack height, so the choice between them is purely a circuit-count decision, not a footprint or height change.
Termination and Retention on the Board
The solder retention pads are part of the footprint — the board layout must include the extra pads for the part to stay put through wave or reflow soldering without shifting. Tape & Reel packaging suits automated pick-and-place assembly lines.