Board-Stacking Header with Dedicated Power Pair
The Hirose BM24-30DP/2-0.35V(53) is a 30-position plus 2 dedicated power contact header from the BM24 series, designed for board-to-board mezzanine stacking at a 0.8mm mated height. The 0.014" (0.35mm) pitch and 0.026" (0.65mm) height above board suit it for tight z-axis budgets in compact handheld or IoT devices. Gold-plated contacts on the mating interface handle repeated connection cycles without fretting corrosion, and the outer shroud contacts provide initial alignment during board mating.
30+2 Position Layout and Routing
The 32 total positions are split as 30 signal contacts and 2 power contacts, a configuration that lets the designer route the main supply rail through the dedicated power pair without loading the signal lines. Compared to the BM24-24DP/2-0.35V(53) with its 24+2 layout, this part adds six signal lines at the same pitch and stack height, so the board footprint expands only in length, not in z-height or routing density. The BM24-40DP/2-0.35V(53) carries 40+2 positions for higher I/O count, but the 30+2 version hits a common sweet spot for mid-density mezzanine links.
Solder retention features on the header body anchor the part to the board during reflow, preventing skew or tombstoning on the fine-pitch 0.35mm pads. Gold finish on the contacts keeps oxidation at bay during storage and through multiple reflow cycles.