The Hirose BM24-30DS/2-0.35V(53) is a 32-position socket with center strip contacts from the BM24 series, designed for board-to-board mezzanine stacking at a 0.8mm mated height. The 0.35mm pitch and dual-row layout target high-density signal routing in compact portable electronics — think smartphone mainboards, wearable modules, or camera sensor boards where every millimeter of board space is allocated.
Position Count and the Power Contact Pair
The 32 total positions break down as 30 signal contacts plus 2 dedicated power contacts — a split that matters for the board layout engineer routing the power rail separately from the signal lines. Against the 26-position BM24-24DS/2-0.35V(53) (24 + 2 power) and the 42-position BM24-40DS/2-0.35V(53) (40 + 2 power), the 30-signal variant sits in the middle of the series range. The pitch and stack height are identical across all three, so the footprint scales only in length — the same pad pattern repeats for the extra signal positions.
The 0.8mm mated stacking height is the single dimension that decides whether this connector fits the z-gap between two parallel PCBs. At this height, the connector is suited for ultra-slim enclosures where the board-to-board clearance is under 1 mm. The 0.031" (0.80mm) height above board on the socket side means the mating plug must sit at the same plane — confirm the total stack-up (socket height + plug height) stays within the enclosure limit before committing the BOM.