Board Layout Fit — 0.35mm Pitch and the 40+2 Position Count
The Hirose BM24-40DP/2-0.35V(53) is a 42-position header in the BM24 series, configured as 40 signal contacts plus 2 power contacts in a dual-row layout. The 0.014" (0.35mm) pitch drives a tight board footprint — the pad pattern for this header will occupy roughly the same real estate as a fine-pitch FFC connector, but with the mechanical retention of a shrouded SMT header. Gold plating on all contacts, surface-mount termination, and solder retention features built into the housing. This is the header half of a board-to-board mezzanine interconnect, designed for a 0.8mm mated stack height.
Mating Half and Stack Height — What Fits
The mating receptacle for this header is the BM24-40DS/2-0.35V(53) — a socket with center strip contacts, same 42-position (40+2) count and 0.35mm pitch, but a slightly taller 0.031" (0.80mm) height above board. When mated, the pair achieves a 0.8mm stacking height. That 0.8mm is the total z-height between the two PCBs — confirm your board-to-board clearance against this figure before layout. The outer shroud on the header aligns with the center strip on the socket; the dual-row arrangement keeps the signal and power contacts separated.
Tape & Reel packaging (standard for pick-and-place), with Cut Tape options for prototyping.