The Hirose BM28B0.6-20DP/2-0.35V(51) is a 20-position, dual-row header from the BM28 series, designed for board-to-board mezzanine stacking at a tight 0.6mm mated height. The 0.014" (0.35mm) pitch is the defining constraint here — it drives the PCB footprint density and demands precise alignment during assembly.
Sizing the Board Stack and Footprint
The 0.6mm mated stacking height is the critical z-dimension for mezzanine applications — it sets the gap between parallel PCBs. At 0.35mm pitch, the board-level routing requires fine-line traces and tightly controlled impedance for high-speed signals. The 0.018" (0.46mm) height above board means the connector sits low, leaving clearance for components on the opposing board. Surface-mount termination with solder retention pads keeps the part in place through reflow and subsequent handling.
This is not a high-cycle or high-current power contact; the thin gold layer protects the base metal during initial mates but will wear with repeated connect-disconnect beyond a few dozen cycles. For applications requiring frequent field servicing, a thicker plating variant would be needed.