0.6 mm stack, 0.35 mm pitch — the mezzanine fit
The Hirose BM28B0.6-24DP/2-0.35V(51) is a 24-position header from the BM28 series, built for board-to-board FFC interconnects where the z-height budget is tight. The 0.35 mm pitch packs 24 contacts into a compact footprint, which means the board layout needs fine trace routing to match. The header uses outer shroud contacts — the mating interface is a shrouded shell that guides the FFC or receptacle into alignment. Gold plating on the contacts, 1.97 µin thick, handles the insertion cycles typical of a fixed mezzanine stack.
24 positions at 0.35 mm pitch — routing density
The 24 positions match a 24-circuit FFC or a 24-pin receptacle on the opposing board. The 0.35 mm pitch is the tightest in the BM28 line — the board footprint requires 0.35 mm between adjacent pad centres, which limits trace escape width on inner layers. Compare with the 20-position sibling BM28B0.6-20DP/2-0.35V(51) at the same pitch and stack height: the extra four positions add routing density without changing the board-to-board gap.
RoHS compliant.