BM28 Mezzanine Receptacle — 34-Position, 0.35 mm Pitch
The Hirose BM28B0.6-34DS/2-0.35V(53) is a 34-position receptacle with center strip contacts, part of the BM28 series designed for ultra-low-profile board-to-board stacking. The 0.014" (0.35mm) pitch and 0.024" (0.61mm) height above board place it in the tight-pitch, low-z-height segment of the series — meant for compact handheld or module-to-motherboard interconnects where every tenth of a millimeter counts.
0.6 mm Stack Height — Board Spacing Constraint
The 0.35mm pitch gives 34 circuits in a dual-row layout that fits a tight board edge, but the routing channel between pads is narrow; expect micro-via or blind-via fanout for inner-layer traces.
Solder retention features are built into the part — these are extra metal tabs or standoffs that reflow to the board pads, holding the connector in place during the solder process and giving some mechanical resistance to the shear load from the mating header. For a 0.6mm stack height, the mated pair is rigid; the retention features matter most during the reflow oven pass and any subsequent handling before the second board is stacked. The connector is surface mount only — no through-hole posts — so the board pads must match the 0.35mm pitch footprint exactly.
ROHS3 compliant. No official second-source or cross-reference exists outside the BM28 series itself. For a BOM line, confirm the 34-position count and the 0.6mm stack height against the mating header before committing the line.