The Hirose BM28N0.6-44DS/2-0.35V(51) is a 44-position receptacle from the BM28 series, designed for board-to-board mezzanine stacking. The mated stacking height is 0.6mm, making this part suited for ultra-low-profile interconnects in portable electronics, wearables, and handheld devices where every millimeter of z-height matters.
The 0.014" (0.35mm) pitch drives the board footprint: traces between pads are narrow, so the PCB fab needs to support fine-line routing. The 0.024" (0.61mm) height above board gives the pick-and-place nozzle clearance during assembly.
Contact Plating and Signal Duty
The BM28B variant uses the same gold contact finish thickness of 1.97µin (0.050µm).
Comparing Circuit Counts in the BM28 Series
The BM28N0.6 family shares the same 0.014" (0.35mm) pitch, 0.024" (0.61mm) height, and gold plating across position counts. The 44-position BM28N0.6-44DS/2-0.35V(51) sits between the 40-position BM28B0.6-40DS/2-0.35V(53) and the 60-position BM28N0.6-60DS/2-0.35V(53) — all with identical footprint geometry per position. Choose the circuit count that matches your signal or power bus width; the footprint scales linearly.