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Hirose Electric Co Ltd BM28N0.6-6DP/2-0.35V(51) — Mezzanine & Stacking Connectors

Hirose BM28N0.6-6DP/2-0.35V(51), 6-Pos 0.35mm Pitch Header

MPNBM28N0.6-6DP/2-0.35V(51)
Active

Hirose BM28 series, 6-position header, 0.014" (0.35mm) pitch, 2 rows, surface mount, gold contact finish, 0.018" (0.46mm) height above board, 0.6mm mated stacking height, solder retention feature.

$0.7400Ref. price · indicative, final on quote
StockIn Stock (18)
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

BM28N0.6-6DP/2-0.35V(51) Technical Specifications
ParameterValue
SeriesBM28
MountingSurface Mount
Connector typeHeader, Outer Shroud Contacts
Height above board0.018\" (0.46mm)
Mated stacking heights0.6mm
Pitch0.014\" (0.35mm)
PackageTape & Reel (TR) Cut Tape (CT)
FeaturesSolder Retention
Contact finishGold
Rows2
Positions6
Contact finish thickness1.97µin (0.050µm)

Product details

The Hirose BM28N0.6-6DP/2-0.35V(51) is a 6-position header from the BM28 series, designed for board-to-board mezzanine stacking at a 0.6 mm mated height.

Board Layout and Stacking Height

With a 0.6 mm mated stacking height and 0.018" (0.46 mm) height above the board, this connector fits into tight z-axis budgets where every tenth of a millimeter counts. The 0.35 mm pitch demands precise PCB layout — the footprint must match the Hirose recommended land pattern to avoid solder bridging between adjacent pads. The solder retention feature anchors the part during reflow, preventing tombstoning and maintaining alignment across the 6 positions.

For a permanent board-stack application where the connector mates once during manufacturing, this plating grade is adequate. If the design requires frequent board separation, a thicker gold option in the BM28 family would be worth evaluating.

Frequently asked questions

What is the stacking height of BM28N0.6-6DP/2-0.35V(51)?

The mated stacking height is 0.6 mm, with the header sitting 0.018" (0.46 mm) above the board surface. This combination fits tight mezzanine gaps in portable device designs.

Does BM28N0.6-6DP/2-0.35V(51) have solder retention?

Yes, the header includes a solder retention feature that anchors the part during SMT reflow, preventing misalignment on the fine 0.35 mm pitch footprint.

Where can I buy BM28N0.6-6DP/2-0.35V(51)?

This part is active and quoted to order.