0.35 mm Pitch, 0.6 mm Stack — Hirose BM29 Mezzanine Header
The Hirose BM29B-2DP/2-0.35V(51) is a 4-position header from the BM29 series, designed for ultra-low-profile board-to-board stacking. It carries a 0.014" (0.35 mm) pitch and mates to a corresponding receptacle to achieve a mated stacking height of 0.6 mm — one of the thinnest mezzanine interconnect profiles available. The two-row layout splits 2 signal contacts and 2 power contacts, letting a single connector handle both a low-current data line and a small power feed in wearable or handheld devices. Gold plating on the contacts suits repeated mating cycles and low-voltage signal integrity.
The 0.35 mm pitch requires a PCB capable of fine-line etching and solder-mask registration. The 0.016" (0.41 mm) height above board and 0.6 mm mated stack height keep the assembly low.
Position Count and Power-Signal Split
The 4-position count is listed as 2 + 2 Power, with two contacts dedicated to power delivery and two for signal.
No end-of-life notice or successor has been recorded.