Ultra-fine pitch header for tight board stacks
The Hirose BM29B-6DP/2-0.35V(53) is an 8-position header with outer shroud contacts from the BM29 series, designed for board-to-FPC or board-to-board interconnects where board real estate is at a premium. Its 0.014" (0.35mm) pitch packs the positions into a narrow footprint, and the 0.6mm mated stacking height suits ultra-thin assemblies like smartphone displays, wearable modules, or miniaturised sensor boards. The position count breaks out as 6 signal contacts plus 2 power contacts — a mixed-duty arrangement that matches designs needing a separate power pair without a second connector.
Position count and power-signal split
The 8 positions are configured as 6 signal and 2 power — the order code's "6DP/2" notation flags this split directly. That means the BOM line must match a design that routes a dedicated power pair through the connector, not a uniform signal array. The 2-row layout keeps the footprint compact; the outer shroud contacts provide mechanical alignment and some strain relief during mating.
Stack height and board clearance
At 0.6mm mated stack height, this header sits at the low end of the BM29 range. The 0.016" (0.41mm) height above board means the connector barely protrudes from the PCB surface — critical when the opposing board or flex sits nearly flush. The 0.35mm pitch demands careful trace routing between pads; a 0.2mm trace/space rule is typical for the breakout region.
Contact finish and mating duty
RoHS compliant per.