75 Ohm SMT Receptacle for D.FL75 — 12 GHz, Snap-On
The D.FL75-R-SMT-1(40): It is designed for coaxial RF interconnects where the 75 Ohm characteristic impedance is required — primarily video, broadband, and satellite IF signal paths, not the 50 Ohm standard used in wireless infrastructure.
20 Mating Cycles — One-Time Install or Occasional Service
It is not designed for daily disconnect/reconnect; the gold plating on the centre contact and body reduces wear, but the snap-on mechanism and contact geometry are optimised for a stable, low-loss RF connection rather than high-cycle durability. For applications requiring frequent reconnection, a threaded or push-pull connector would be a better fit.
SMT Termination and Board Layout
Surface-mount termination with solder shield termination and solder contact termination — the centre pin and outer shield both reflow onto the PCB pads. The LCP (Liquid Crystal Polymer) dielectric maintains dimensional stability through reflow and holds the 75 Ohm impedance across the operating temperature range. The board footprint must match the D.FL75 series recommended land pattern to keep the impedance through the launch; a ground plane cutout under the pad is typical for this connector class.