Board-Stacking Interconnect for High-Density Mezzanine Designs
The Hirose DF12A(3.0)-60DS-0.5V(81) is a 60-position receptacle with center strip contacts, part of the DF12 series of board-to-board mezzanine connectors. It mates with the corresponding DF12 header to create a 3mm mated stack height, a common z-height for parallel PCB stacking in compact electronics like handheld devices, cameras, and portable instrumentation.
Obsolete Status — Sourcing Reality
Hirose lists the DF12A(3.0)-60DS-0.5V(81) as Obsolete.
For a 60-position, dual-row receptacle, the footprint spans roughly 15 mm along the board edge, with each row offset to allow routing escape vias. Gold plating at 8.00µin is adequate for moderate mating cycle counts typical of internal mezzanine connections, not for frequent field-service disconnect.