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Hirose Electric Co Ltd DF12A(3.0)-80DS-0.5V(81) — Board-to-Board Connectors

Hirose DF12A(3.0)-80DS-0.5V(81), 80-pos 0.50mm Receptacle

MPNDF12A(3.0)-80DS-0.5V(81)
Obsolete

Hirose DF12 Series, 80 Position, 0.020" (0.50mm) Pitch, 2 Row, Receptacle, Center Strip Contacts, Surface Mount, Gold, 3mm Mated Stacking Height.

$2.5400Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Jul 2026

Specifications

DF12A(3.0)-80DS-0.5V(81) specifications
ParameterValue
SeriesDF12
MountingSurface Mount
Connector typeReceptacle, Center Strip Contacts
Height above board0.087\" (2.20mm)
Mated stacking heights3mm
Pitch0.020\" (0.50mm)
PackageTape & Reel (TR) Cut Tape (CT)
FeaturesBoard Guide
Contact finishGold
Rows2
Positions80
Contact finish thickness8.00µin (0.203µm)

Product details

80 I/O in a 0.50mm Pitch — the DF12 Mezzanine Receptacle

The Hirose DF12A(3.0)-80DS-0.5V(81) is an 80-position, 2-row receptacle from the DF12 series of board-to-board mezzanine connectors. It uses a 0.50mm pitch and center strip contacts to pack 80 signal lines into a compact footprint, with a mated stack height of 3mm — a common spacing for parallel PCB stacking in portable electronics, handheld instruments, and compact embedded systems. The receptacle is surface-mount with gold-plated contacts (8.00µin gold over nickel) and includes a board guide feature to assist alignment during assembly.

The 0.50mm pitch is tight enough that routing all 80 signals out of the inner rows typically requires at least a 4-layer PCB with microvias or blind vias under the footprint. The 3mm mated stack height is fixed — the mating header in the DF12 series must also specify a 3mm stacking height to pair correctly. The receptacle body sits 2.20mm above the board before mating, which sets the clearance needed during pick-and-place and reflow soldering.