Hirose DF12 series, 10 position, 0.020" (0.50mm) pitch, 2 row, surface mount header with outer shroud contacts, gold plating, 3mm mated stacking height, solder retention features.
| Parameter | Value |
|---|---|
| Series | DF12 |
| Mounting | Surface Mount |
| Connector type | Header, Outer Shroud Contacts |
| Height above board | 0.091\" (2.30mm) |
| Mated stacking heights | 3mm |
| Pitch | 0.020\" (0.50mm) |
| Package | Tape & Reel (TR) Cut Tape (CT) |
| Features | Solder Retention |
| Contact finish | Gold |
| Rows | 2 |
| Positions | 10 |
| Contact finish thickness | 8.00µin (0.203µm) |
The Hirose DF12B(3.0)-10DP-0.5V(86) is a 10-position, dual-row header from the DF12 series, designed for parallel board-to-board stacking at a 3mm mated height. The 0.50mm pitch keeps the board footprint tight — suited for compact handheld or portable equipment where every millimeter of PCB real estate counts. The SMT solder tails include solder retention features that hold the part in place during reflow, reducing tombstoning on dense boards.
The DF12 series includes many 10-position, 0.50mm pitch headers at a 3mm stack height, but without a direct successor designation, the closest match must be verified against the board footprint and mating half. Submit an RFQ with your BOM details for cross-reference support.
The pitch is 0.50mm and the mated stacking height is 3mm. The header has 10 positions in a dual-row layout, surface-mount terminated with solder retention features.