Board-Stacking Header for 3 mm Mezzanine Spacing
The Hirose DF12B(3.0)-14DP-0.5V(86) is a 14-position, dual-row board-to-board header from the DF12 series, designed for a fixed mated stacking height of 3 mm.
The 0.50 mm pitch drives the board routing density — traces between pads need controlled impedance stack-ups for high-speed signals, and the narrow pitch limits per-contact current to what the thin beams can handle without excessive temperature rise. The 2.30 mm height above board (0.091") leaves clearance for low-profile components on the underside of the opposing board.
Termination is surface-mount only — no through-hole option. The solder retention features help keep the part aligned during reflow soldering, reducing tombstoning risk on the narrow-pitch footprint.