0.50mm pitch, 30 positions, 3mm stack — the mezzanine fit
The DF12B(3.0)-30DP-0.5V(86): It is an SMT header with outer shroud contacts and gold plating (8.00µin) on the contact finish, plus solder retention features for reflow hold.

Hirose DF12 series, 0.020" (0.50mm) pitch board-to-board header, 30 positions, 2 rows, 3mm mated stacking height, SMT, gold-plated contacts, outer shroud, solder retention.
| Parameter | Value |
|---|---|
| Series | DF12 |
| Mounting | Surface Mount |
| Connector type | Header, Outer Shroud Contacts |
| Height above board | 0.091\" (2.30mm) |
| Mated stacking heights | 3mm |
| Pitch | 0.020\" (0.50mm) |
| Package | Tape & Reel (TR); Cut Tape (CT) |
| Features | Solder Retention |
| Contact finish | Gold |
| Rows | 2 |
| Positions | 30 |
| Contact finish thickness | 8.00µin (0.203µm) |
The DF12B(3.0)-30DP-0.5V(86): It is an SMT header with outer shroud contacts and gold plating (8.00µin) on the contact finish, plus solder retention features for reflow hold.
The mated stacking height is 3mm. This is the dimension between the two parallel PCBs when mated with the corresponding receptacle.