Board-to-Board Mezzanine Interconnect at 0.50mm Pitch
The Hirose DF12B(3.0)-32DS-0.5V(86) is a 32-position receptacle with center strip contacts from the DF12 series, designed for board-to-board mezzanine stacking at a 3mm mated height. Gold plating on the contacts (8.00µin) handles the repeated mating cycles a field-serviceable device demands; the solder retention feature keeps the connector anchored through reflow without shifting.
What the 3mm Stack Height and Solder Retention Mean on the Line
The 3mm mated stacking height sets the board-to-board gap — your mezzanine design must allocate exactly that z-height between the two PCBs. The solder retention feature adds holding force during reflow, which reduces the chance of the connector lifting or skewing on the paste. Surface-mount termination with gold-over-nickel contacts (8.00µin gold) gives a reliable interconnect for moderate-cycle applications — think test fixtures, handheld terminals, or instrumentation where the boards need to separate for service.