Hirose DF12 series, 0.020" (0.50mm) pitch board-to-board header, outer shroud contacts, 36 positions, 2 rows, 3mm mated stack height, surface mount, gold plating 8.00µin, solder retention.
| Parameter | Value |
|---|---|
| Series | DF12 |
| Mounting | Surface Mount |
| Connector type | Header, Outer Shroud Contacts |
| Height above board | 0.091\" (2.30mm) |
| Mated stacking heights | 3mm |
| Pitch | 0.020\" (0.50mm) |
| Package | Tape & Reel (TR) Cut Tape (CT) |
| Features | Solder Retention |
| Contact finish | Gold |
| Rows | 2 |
| Positions | 36 |
| Contact finish thickness | 8.00µin (0.203µm) |
The Hirose DF12B(3.0)-36DP-0.5V(86) is a 36-position, 2-row board-to-board header from the DF12 series, using outer shroud contacts on a 0.020" (0.50mm) pitch. It is designed for parallel board stacking at a 3mm mated stack height, making it a compact mezzanine interconnect for space-constrained assemblies.
The 36 positions in 2 rows give 18 contacts per row, matching a 36-circuit BOM line.
A pin-compatible alternative within the Hirose DF12 family would need to match the 0.50mm pitch, 36 positions, 2 rows, and 3mm mated stack height. Check the DF12 series datasheet for current-production variants that meet these parameters.
The DF12B(3.0)-36DP-0.5V(86) has a 0.020" (0.50mm) pitch. This fine pitch drives the board footprint and requires careful routing between pads.
This obsolete part is sourced to order against your RFQ.