Board-Stacking Interconnect at 0.50mm Pitch
The Hirose DF12B(3.0)-36DS-0.5V(86) is a 36-position receptacle from the DF12 series, designed for board-to-board mezzanine stacking. It uses a 0.020" (0.50mm) pitch in a dual-row arrangement with center strip contacts, giving 36 circuits in a compact footprint that suits dense PCB layouts. The mated stacking height is 3mm, with the connector sitting 0.087" (2.20mm) above the board surface — a dimension that governs the z-height budget and component keep-out on the underside of the mezzanine card.
The 3mm mated stacking height is set by the combination of this receptacle (2.20mm above board) and the corresponding header height — the total board-to-board gap after mating is 3mm, which is the key dimension for the mezzanine card standoff. The dual-row layout with center strip contacts means the pinout is a simple 2 x 18 grid; signal routing on the PCB should match the contact numbering in the Hirose DF12 series datasheet.