The Hirose DF12B(3.0)-50DP-0.5V(86) is a 50-position, dual-row header from the DF12 series, designed for board-to-board mezzanine stacking. Gold-plated outer shroud contacts (8.00 µin) on both mating surfaces give this header the cycle life for production test or field-serviceable assemblies where the board pair may be separated and re-mated multiple times.
The pitch sets the footprint pad spacing — a 50-position dual-row layout at 0.50 mm pitch means 25 contacts per row, with a row-to-row spacing that is standard for the DF12 series. That is a relatively low profile for a mezzanine interconnect, suited to tight z-height budgets in portable or compact equipment. The SMT pads need a solder paste stencil aperture sized for the 0.50 mm pitch to avoid bridging between adjacent joints.