Board-to-Board Mezzanine Header, 20 Positions, 0.50 mm Pitch
The Hirose DF12B(4.0)-20DP-0.5V(86) is a 20-position, dual-row board-to-board mezzanine header with a 0.50 mm pitch. Typical use is in compact electronics where board spacing is tight — think handheld devices, cameras, or module-to-mainboard interconnects.
The mated stack height is 4 mm, with the header itself standing 3.30 mm above the board.
Termination and Assembly Notes
Surface-mount termination with solder retention — the extra metal tabs on the body wick solder and hold the header flat during reflow. No through-hole anchors; the joint relies on the pad and the retention feature for shear strength.