0.50 mm pitch, 14 positions, 3 mm stack
The DF12C(3.0)-14DS-0.5V(81): The 0.50 mm pitch drives a tight board footprint — the layout engineer needs to confirm the keep-out zone for the center strip contacts and route the traces between the pads. Gold contact finish at 8.00 µin thickness provides a reliable interface for moderate mating cycles — enough for production-level board stacking but not extended field-service reconnect duty.
Obsolete — sourcing path for the BOM line
No official successor is recorded in the available documentation.