The Hirose DF12D(3.0)-60DP-0.5V(81) is a 60-position header from the DF12 series, designed for board-to-board mezzanine stacking. It uses outer shroud contacts that protect the mating interface and guide alignment during assembly. The 0.020" (0.50mm) pitch and dual-row layout pack 60 circuits into a compact footprint, suited for dense PCB layouts in portable electronics, handheld devices, and other space-constrained internal interconnects.
This header is specified for a 3mm mated stacking height, which means the board-to-board gap after mating the receptacle is exactly 3mm.
The DF12D(3.0)-60DP-0.5V(81) is listed as Obsolete. If a pin-compatible alternative from the same DF12 series exists, it would share the 0.50mm pitch and 60 positions, but no direct cross-reference is documented here.
Surface mount termination, with gold-plated contacts. The SMT pads follow the 0.50mm pitch layout; the board guide adds mechanical alignment during reflow.