Board-to-Board Header for Tight Stacking
The Hirose DF12D(3.0)50DP0.5V80 is a 50-position header from the DF12 series, designed for parallel board-to-board stacking. It uses a 0.020" (0.50mm) pitch across two rows, keeping the board footprint compact while delivering 50 signal paths. Gold-plated contacts on the mating interface handle repeated connect-disconnect cycles without corrosion — a common requirement in test fixtures or modular designs where the boards are swapped during development. The connector sits 0.091" (2.30mm) above the PCB and mates to a stacking height of 3mm, which sets the gap between the two parallel boards. The surface-mount termination means reflow soldering is the assembly method — no through-hole tails to hand-solder or wave-solder.
Obsolete — Finding a Drop-In Replacement
The DF12 series has several active variants with the same 0.50mm pitch and 50-position, 2-row layout. The key footprint parameters are the pitch (0.50mm), the position count (50), the number of rows (2), and the stacking height (3mm). Any replacement must match all four to land on the same board layout and mate with the same receptacle. A pin-compatible candidate would be another DF12 header with the same "(3.0)" stacking height code and "50DP" position/row designation — the suffix after "DF12" tells the story. Cross-reference the exact order code against Hirose's current DF12 catalog to confirm the active part number. Because the part is EOL, sourcing relies on surplus or broker inventory.