Board-to-board header for tight mezzanine stacks
The DF12E(3.0)-32DP-0.5V(81): Gold contact finish at 8.00µin thickness provides reliable signal connections across repeated mating cycles typical in portable or modular electronics.
Obsolete status and sourcing path
For BOM planning, consider a last-time buy or identify a pin-compatible replacement within the DF12 series or a similar Hirose board-to-board family.
Surface-mount pads on a 0.50mm pitch require careful PCB layout to maintain signal integrity and avoid solder bridging during reflow.
