50-Position Mezzanine Header, 0.50mm Pitch, 3mm Stack
The Hirose DF12E(3.0)-50DP-0.5V(81) is a 50-position, dual-row surface-mount header from the DF12 series, designed for board-to-board mezzanine interconnects. It uses outer shroud contacts and is pitched at 0.50 mm, with a mated stacking height of 3 mm and a height above board of 2.30 mm. The contacts are gold-plated to 8.00 µin — suitable for the moderate mating cycle counts typical of internal mezzanine links in portable electronics and compact embedded systems.
Obsolete — No Official Successor on Record
There is no documented official replacement order code from Hirose — the DF12 series has seen multiple revisions and the (81) packaging suffix indicates an older production code. For a form-fit-function cross, the buyer needs to verify the footprint, 0.50 mm pitch, 50 positions, 3 mm stack height, and the outer shroud contact geometry against any current Hirose DF12 variant. Sourcing is through surplus and independent distribution channels; availability and pricing are confirmed per RFQ.
Footprint and Stack Height for Board Layout
The 0.50 mm pitch and 50 positions in two rows define a tight board footprint — the SMT pads sit on a 0.50 mm grid, requiring a fine-pitch reflow process and careful solder paste stencil design. The 2.30 mm height above board and 3 mm mated stacking height fix the card-to-card spacing at 3 mm, which is common for parallel-stacked PCBs in handheld or space-constrained enclosures. The outer shroud contacts provide alignment during mating and protect the signal pins from stubbing.