The Hirose DF12E(3.0)-60DP-0.5V(81) is a 60-position, 0.50mm pitch board-to-board header from the DF12 series, designed for mezzanine stacking applications where the mated height between PCBs is exactly 3mm. The outer shroud contacts provide alignment during mating and protect the signal pins from side-load damage during assembly — a common failure point on unshrouded fine-pitch headers.
Sourcing Reality — This Part Is Obsolete
The DF12E(3.0)-60DP-0.5V(81) is officially listed as Obsolete. This means the manufacturer has stopped production, and no direct factory orders are possible.
The 0.50mm pitch places this connector in the fine-pitch mezzanine class — the board layout must accommodate tight routing between pads, and the solder mask registration tolerance becomes critical for reliable reflow. The two-row arrangement with 60 total positions means 30 contacts per row, which is a dense interconnect for a 3mm stack — verify that your opposite-board receptacle has the same position count and pitch before committing.
Contact Finish and Surface Mount Termination
The surface mount termination requires a reflow soldering profile compatible with the DF12 series body material; the Tape & Reel packaging is standard for automated pick-and-place assembly. The 2.30mm height above board (0.091") is the component standoff after soldering, which factors into the total stack height calculation.