Hirose DF12E(3.5)-30DP-0.5V(81) — 30-Position, 0.50mm Pitch Board-to-Board Header
The Hirose DF12E(3.5)-30DP-0.5V(81) is a 30-position, dual-row board-to-board header from the DF12E series, designed for parallel PCB stacking with a fixed mated height of 3.5mm. It uses 0.020" (0.50mm) pitch contacts arranged in two rows, with gold plating on the mating surfaces — 8.00µin (0.203µm) thick — suited for signal-level interconnects where corrosion resistance and moderate mating cycle life are needed. The outer shroud contact design provides mechanical protection during handling and alignment during mating. This is a surface-mount part, supplied in Tape & Reel packaging for automated pick-and-place assembly.
Stacking Height and Board Fit — 3.5mm Fixed Gap
This header is specified for a 3.5mm mated stacking height — the distance between the two PCBs when the header is mated with its matching receptacle. That dimension is fixed by the body design, not adjustable. The 0.50mm pitch keeps the board footprint compact, but the tight pitch also limits the routing channel width between pads on the PCB — a 0.25mm trace with 0.25mm clearance is about the practical limit on a standard FR4 layer. The 0.110" (2.80mm) height above board is the un-mated profile of the header alone; the full stack height includes the receptacle on the opposing board.