Board-stacking fit for mezzanine designs
The DF12E(3.5)-36DP-0.5V(81): Gold plating at 8.00µin on the contacts handles repeated mating cycles without corrosion, typical for production-level mezzanine interconnects where the boards are separated only during rework.
Sourcing an obsolete part
Hirose lists the DF12E(3.5)-36DP-0.5V(81) as obsolete. No direct replacement from the same series is recorded in the official lifecycle data.
