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Hirose Electric Co Ltd DF12E(4.0)-30DP-0.5V(81) — Board-to-Board Connectors

Hirose DF12E(4.0)-30DP-0.5V(81) Header, 30 Pos, 0.50mm Pitch

MPNDF12E(4.0)-30DP-0.5V(81)
Obsolete

Hirose DF12 series, 30 Position Header, Outer Shroud Contacts, 0.020" (0.50mm) Pitch, Surface Mount, 2 Rows, 0.130" (3.30mm) Height Above Board, Gold.

$1.4500Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Jul 2026

Specifications

DF12E(4.0)-30DP-0.5V(81) specifications
ParameterValue
SeriesDF12
MountingSurface Mount
Connector typeHeader, Outer Shroud Contacts
Height above board0.130\" (3.30mm)
Mated stacking heights4mm
Pitch0.020\" (0.50mm)
PackageTape & Reel (TR)
Contact finishGold
Rows2
Positions30
Contact finish thickness8.00µin (0.203µm)

Product details

Obsolete — Sourcing Reality for the DF12E(4.0)-30DP-0.5V(81)

The Hirose DF12E(4.0)-30DP-0.5V(81) is listed as obsolete, meaning Hirose no longer manufactures this exact order code.

What This Connector Is — DF12 Series Board-to-Board Header

The Hirose DF12E(4.0)-30DP-0.5V(81) is a 30-position header from the DF12 series, designed for board-to-board parallel stacking. The connector stands 0.130" (3.30mm) above the board and achieves a mated stacking height of 4mm when paired with the matching DF12 receptacle. This geometry suits tight z-height budgets in portable electronics, handheld instruments, and other space-constrained assemblies where two PCBs need a reliable signal interconnect.

Board Layout Fit — Pitch, Stack Height, and Footprint

The 0.50mm pitch drives the board layout — the SMT pads are closely spaced, so the PCB fab must handle fine-pitch registration and solder paste deposition. The 30 positions across two rows give 15 contacts per row, which sets the footprint length at roughly 7.5mm plus keep-out. Gold plating at 8.00µin on the contacts provides corrosion resistance for the expected mating cycle count in consumer and industrial environments — adequate for assembly and occasional rework, not for high-cycle field service.

Frequently asked questions

What is the mated stacking height of the DF12E(4.0)-30DP-0.5V(81)?

The mated stacking height is 4mm when mated with the corresponding DF12 series receptacle. The header itself sits 0.130" (3.30mm) above the board surface.

What is the pitch of the DF12E(4.0)-30DP-0.5V(81)?

The pitch is 0.020" (0.50mm), a fine-pitch spacing typical of compact board-to-board interconnects.