The Hirose DF12NB(3.5)-30DP-0.5V(51) is a 30-position board-to-board header from the DF12 series, designed for mezzanine stacking applications. It uses a 0.50mm pitch with two rows of outer shroud contacts, mated to a 3.5mm stacking height. The gold-plated contacts (8.00µin) suit signal-level duty where repeated mating cycles and corrosion resistance matter.
Board Layout and Stacking Fit
The 0.50mm pitch sets the footprint density — expect fine-pitch routing and a tight keep-out zone around the pads. The header itself sits 2.80mm above the board surface, so the bottom-side clearance under the connector is that height minus the PCB thickness. Two rows of contacts give 30 total positions; the outer shroud design means the receptacle housing wraps around this header, which centres the mate and protects the contacts during blind mating.