The Hirose DF12NC(3.0)-20DS-0.5V(51) is a 20-position receptacle with center strip contacts from the DF12 series, designed for parallel board stacking at a 3 mm mated height. The 0.50 mm pitch keeps the board footprint compact, while the dual-row layout gives 20 I/O in a narrow body — a common choice for mezzanine interconnects in portable electronics, handheld instruments, and compact compute modules where board-to-board spacing is tight.
Pitch and Stacking Height Set the Board Layout
The 3 mm mated stacking height is the dimension that decides component keep-out on both boards; anything taller than 2.5 mm on the underside of the top board risks interfering with the mated pair. The 0.087" (2.20 mm) height above board is the receptacle sitting on the bottom board before the header mates — that dimension plus the header height sums to the 3 mm stack.
Gold Contacts and Surface Mount Termination
The DF12NC(3.0)-20DS-0.5V(51) sits between the 14-position DF12NC(3.0)-14DS-0.5V(51) and the 30-position DF12NC(3.0)-30DS-0.5V(51) in the same 0.50 mm pitch, 2-row, 3 mm stacking height family. If the BOM calls for 20 circuits, this is the exact match; the 14-position version is shorter and the 30-position is longer, so the footprint changes with the count.