Mezzanine Header for Tight Board Spacing
The Hirose DF12NC(3.0)-30DP-0.5V(51) is a 30-position, 2-row header from the DF12 series, designed for board-to-board mezzanine stacking. It uses a 0.50mm pitch and outer shroud contacts, with a mated stack height of 3mm — a common spacing for parallel PCB assemblies in compact consumer and industrial electronics.
What the 3mm Stack Height Means for Your Layout
The 3mm mated stacking height is the fixed z-axis dimension when this header is mated with its corresponding DF12 receptacle. The 0.50mm pitch keeps the board footprint compact — expect two rows of SMT pads at 0.50mm centers, which routes comfortably on a two-layer board with 0.15mm trace/space rules.
Mating Pair and Position Options
This header mates with the DF12NC(3.0)-30DS-0.5V(51) receptacle, which carries center strip contacts and a 2.20mm height above board. If your BOM calls for 40 or 50 positions instead of 30, the same 0.50mm pitch and 3mm stack height are available in the DF12NC(3.0)-40DP-0.5V(51) and DF12NC(3.0)-50DP-0.5V(51) headers — a straight position-count swap with no footprint redesign beyond the extra pad length.