0.50mm Pitch, 3mm Stack — DF12 Mezzanine Receptacle
The Hirose DF12NC(3.0)-30DS-0.5V(51) is a 30-position receptacle from the DF12 series of board-to-board mezzanine connectors, designed for parallel PCB stacking with a fixed 3mm mated height. Gold-plated contacts (8.00µin) on the mating interface handle moderate cycle life in controlled environments — think production-grade assemblies rather than field-swappable modules.
Stack Height and Footprint — What the 3mm Means
The 3mm mated stacking height is the fixed board-to-board gap when this receptacle mates with its corresponding DF12 header. The 0.50mm pitch gives a tight but routable grid: two traces between pads on a single layer are possible with a fine-line PCB process, but expect to drop to one trace per channel on inner layers. Surface-mount termination keeps the assembly reflow-compatible, though the narrow pitch demands careful solder paste stencil design to avoid bridging.
The DF12NC(3.0)-30DS-0.5V(51) sits at 30 positions within a family that also includes 20-position (DF12NC(3.0)-20DS-0.5V(51)), 32-position (DF12NC(3.0)-32DS-0.5V(51)), and 40-position (DF12NC(3.0)-40DS-0.5V(51)) variants — all sharing the same 0.50mm pitch, 3mm stack height, gold plating thickness, and SMT footprint pattern. If your design needs 30 signal lines, this is the one; if you need 32, the sibling is a direct parametric swap with two extra contact positions.