3 mm Stack, 50 Circuits, 0.50 mm Pitch — DF12 Mezzanine Header
The Hirose DF12NC(3.0)-50DP-0.5V(51) is a 50-position header from the DF12 series, designed for board-to-board mezzanine stacking.
Position Count and Board Fit
The 50-position count matches a 50-circuit BOM line directly. The same series offers 40-position (DF12NC(3.0)-40DP-0.5V(51)) and 60-position (DF12NC(3.0)-60DP-0.5V(51)) variants at the same 0.50 mm pitch and 3 mm stack height — so if the circuit count changes, the footprint pitch and z-height stay consistent, and only the board length scales.
SMT Termination and Assembly
Surface-mount termination places this header on the top side of the board, reflow-soldered alongside other SMD components. The outer shroud provides mechanical alignment during pick-and-place and protects the contacts from solder wicking. The 0.50 mm pitch demands a clean solder paste stencil and a tight reflow profile — standard for fine-pitch mezzanine connectors.