Board-Stacking Fit at 3.5 mm
The Hirose DF12NC(3.5)-50DP-0.5V(51) is a 50-position header from the DF12 series, designed for board-to-board mezzanine stacking at a mated height of 3.5 mm. Gold plating at 8.00µin on the mating interface handles repeated connect-disconnect cycles typical of test or modular assemblies.
Position Count vs Stack Height — Two Decisions
The 50-position DF12NC(3.5)-50DP-0.5V(51) sits between the 40-position DF12NC(3.5)-40DP-0.5V(51) and the 60-position DF12NC(3.0)-60DP-0.5V(51) in the same DF12 family. The key difference from the 40-position sibling is the extra 10 signal lines at the same 3.5 mm stack height — match the position count to your circuit count, not the other way around. Against the 60-position DF12NC(3.0)-60DP-0.5V(51), the stack height drops to 2.30 mm, so the board gap is tighter; pick the height that clears your tallest component on the underside of the top board.
SMT Assembly and Footprint
Surface-mount termination with outer shroud contacts means the header reflows on a standard pick-and-place line — no through-hole soldering, no secondary operations. The 0.50 mm pitch demands a clean solder-paste stencil and tight registration; the shroud adds a few tenths of a millimetre to the keep-out zone around the footprint, so check the board layout against the Hirose recommended land pattern before committing.