Board-Stacking Interconnect for Tight Z-Budgets
The Hirose DF12NC(4.0)-50DP-0.5V(51) is a 50-position header from the DF12 series, designed for parallel board-to-board stacking. The dual-row, outer-shroud contact layout gives 50 signal paths in a compact footprint — the pitch keeps the board routing dense, and the 4mm stack height sets the z-axis budget for the assembly. Gold-plated contacts (8.00µin) on both mating surfaces handle the signal duty for moderate-cycle applications.
SMT Retention and Assembly Fit
For a 50-position, 0.50mm-pitch part, the solder retention is a practical detail — without it, the narrow SMT pads alone might not hold alignment through the wave or reflow oven.
Position Count vs. Siblings
Within the DF12NC(4.0) subfamily, the 50-position version is the highest-density option. For a BOM that needs 50 signal lines, this is the one; the 30-position variant fits when the routing density is lower. The 40-position DF12NC(4.0)-40DP-0.5V(51) sits between them, same footprint class.
Active lifecycle status — no end-of-life pressure on this order code. RoHS compliant per the listing.