Board-to-Board Mezzanine Header, 30 Positions at 0.50mm Pitch
The Hirose DF12NC(5.0)-30DP-0.5V(51) is a 30-position header from the DF12 series, designed for board-to-board mezzanine stacking. The surface-mount termination keeps the footprint clean for automated pick-and-place assembly.
The 0.50mm pitch demands tight routing discipline on the PCB — trace widths and spacing must be managed to avoid crosstalk between adjacent signal lines. At 30 positions in two rows, the connector occupies roughly 7.5mm of board edge per row (15 positions per row at 0.50mm). The outer shroud adds a few tenths of a millimeter beyond the contact row for alignment, so plan keep-out zones accordingly.
How the 30-Position Version Compares to the 40-Position Sibling
The DF12NC(5.0)-30DP-0.5V(51) shares the same 0.50mm pitch, 5mm stack height, gold plating, and surface-mount footprint as the 40-position DF12NC(5.0)-40DP-0.5V(51). If your BOM calls for 30 signal lines, this is the correct member — the 40-position version adds 10 unused pins that waste board area and increase cost.