The Hirose DF12(3.0)-80DP-0.5V(80) is an 80-position, 0.50 mm pitch mezzanine header from the DF12 series, designed for parallel board-to-board stacking at a mated height of 3 mm. The outer shroud contacts wrap the signal pins in a continuous ground reference — the shroud mates with the receptacle's outer wall to contain radiated emissions and maintain a controlled impedance environment through the stack. Gold contact finish on both mating and termination surfaces supports repeated mating cycles without degradation. Board guide features on the housing align the mating halves during assembly, and solder retention tabs on the SMT feet anchor the part through reflow — both are standard on the DF12 series for automated pick-and-place lines.
The DF12(3.0)-80DP-0.5V(80) is marked Obsolete by Hirose. There is no documented last-time-buy date or official successor order code in the lifecycle record. For a board already laid out to this footprint, the sourcing path is the surplus and independent distribution channel — stock is finite and drawn down as buyers close out their builds. If your design is still in the layout phase, the practical move is to evaluate a current-production DF12 variant at the same 0.50 mm pitch and 80 positions — the DF12 series includes active members with the same outer shroud contact geometry and board guide features. A pin-to-pin footprint comparison against the active datasheet is the only way to confirm interchangeability; the key variables are the solder pad layout and the mated stack height target.
Mating Half and Board-Layout Fit
The outer shroud contacts on the header side engage with the receptacle's inner shroud wall — the pair forms a continuous ground shell around the signal pins. The 3 mm mated stacking height is set by the header's 2.30 mm above-board height plus the receptacle's height; confirm the receptacle's own above-board dimension from its datasheet to verify the total stack clears your enclosure. Surface-mount termination with solder retention tabs. The 0.50 mm pitch demands a controlled-impedance PCB stack. Board guide features on the header body mate with corresponding holes on the receptacle side.