The Hirose DF12(3.0)50DP-0.5V(80) is a 50-position header from the DF12 series, designed for board-to-board mezzanine stacking. It uses outer shroud contacts on a 0.50 mm pitch across two rows, with a fixed mated stacking height of 3 mm — the "3.0" in the order code signals that height. Gold contact finish suits moderate-cycle-count applications where signal integrity matters over repeated matings.
Board Layout and Stacking Constraints
At 0.50 mm pitch, the footprint demands tight trace routing — expect 0.25 mm or narrower traces between pads, with micro-vias if routing to inner layers. Surface-mount termination with solder retention pads adds shear strength, but the narrow pitch means the board layout engineer should verify solder mask registration and pad geometry against the Hirose recommended footprint.
No factory orders are accepted — the only channel is surplus inventory or broker stock. For a BOM line that still calls out DF12(3.0)50DP-0.5V(80), the procurement decision is whether to buy remaining stock or qualify a replacement. There is no official successor listed in the lifecycle record, so a pin-compatible alternative would need to be evaluated against the 0.50 mm pitch, 50 positions, and 3 mm stacking height.