Board-Stacking Interconnect for Tight Mezzanine Gaps
The Hirose DF12(3.5)36DP0.5V(80 is a 36-position header with outer shroud contacts from the DF12 series, designed for board-to-board mezzanine stacking at a mated height of 3.5mm. The 0.50mm pitch packs 36 circuits into a compact footprint, with the dual-row layout keeping the board edge narrow enough for dense PCB layouts.
The 0.50mm pitch sets the trace escape routing: you need micro-vias or tight neck-downs between pads, and the PCB fab must handle the finer registration. Surface mount termination means the header reflows alongside other SMT components — no through-hole solder tails to plan for on the opposite side.
The outer shroud contacts on the header align with the receptacle's inner contact beams.
